 | ||
| CONTENTS |
| ·TOP |
The glazed substrates are usued
for thermal heads of
a facsimile equipment,
a copy machine and a printer.
Variation of Glazed substrates |
|
Size of Glazed Substrates |
| Glazed
Substrates Properties |
 | |
 | |
| ♦Full
glazed substrates ♦Partially glazed substrates ♦R shape edged glazed substrates ♦Fine structured glazed substrates (e.g. linear line patterned) | |
 |  |
| ♦Up to 380mm long available | |
 | |
PROPERTIES | UNIT | TYPES OF GLAZING | |||||||
| ＮＫＧ－ １１ | ＮＫＧ－ １２ | ＮＫＧ－ １３ | ＮＫＧ－ ３１ | ＮＫＧ－ ３２ | ＮＫＧ－ ３３ | ＮＫＧ－ ３４ | ＮＫＧ－ ３５ | ||
| Expansion
coefficiency (RT~400·C) | １／ ·C | 65×10-7 | 70×10-7 | 66×10-7 | 66×10-7 | 64×10-7 | 68×10-7 | 74×10-7 | 71×10-7 |
| Transformation
point | ·C | 665 | 680 | 450 | 740 | 740 | 680 | 690 | 745 |
| Softing point | ·C | 850 | 850 | 600 | 910 | 930 | 845 | 830 | 895 |
| Bulk density | ｇ／ cm3 | 3.0 | 3.4 | 4.7 | 3.0 | 3.0 | 3.0 | 3.1 | |
| Thermal
conductivity(25·C) | Ｗ／ ｍＫ | 0.84 | 0.798 | － | 0.924 | 0.84 | 0.84 | 0.88 | |
| Dielectric constant(1MHz,RT) | － | 7.2 | 7.8 | 9.5 | 9.0 | 9.0 | 6.3 | ||
| Dielectric loss(1MHz,RT) | － | 0.0015 | 0.0014 | 0.012 | 0.0005 | 0.001 | 0.0003 | ||
| Composition | SiO2 Al2 O3 BaO CaO B2O3ZnO | SiO2 |
SiO2 B2O3 PbO | SiO2 Al2O3 BaO CaO La2 O3 | SiO2 Al2O3 BaO CaO La2O3 | SiO2 | SiO2 Al2O3 BaO CaO | SiO2 | |
| Remarks | For
thin film TPH | For thin film line | For
thick | For | For thin film, Higher expansion coefficent | For thick film, Higher expansion coefficent | |||