| CONTENTS |
| ·TOP |
Low
Temperature Co-Fired
Ceramic Substrates
(LTCC Substrates)
Air
Cavity PackagesMultilayer
Piezo CeramicsMicrowave
Dielectric CeramicsVias
Filled SubstratesGlazed
Alumina SubstratesAssembly
and Assembling | | | ||||||||||||
| | | | | ||||||||||
|
| |||||||||||||
| ||||||||||||||
|
| |||||||||||||
| Air
Cavity Packages | ||||||||||||||
| Multilayer
Piezo Ceramics | ||||||||||||||
| Microwave
Dielectric Ceramics | ||||||||||||||
| Vias
Filled Substrates | ||||||||||||||
| Glazed
Alumina Substrates | ||||||||||||||
| Assembly
and Assembling | ||||||||||||||
| All Rights Reserved, Copyright(C) NIKKO COMPANY 2003 ec-info@nikko-company.co.jp | ||||||||||||||