Cost-Effective Upgrade of Conventional
Printed 96% Al2O3 Substrates

Conventional connections between circuits on a front and back of
96% Al2O3 substrate are manufactured by way of through holes.
Nikko successfully established the plugged via technology,
developing conductor pastes optimized for shrinkage during firing.
The technology was first applied to an on-board power supply
in 1992 and resulted in 50% size reduction.
Nikko supplies a variety of upgraded 96% Al2O3 commodities through this technology.
Nikko recommends this technology as the best solution to miniaturization,
functional and reliability upgrade.